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CONTACT FRAME FOR INTEL LGA1851 AND LGA1700: Better contact pressure distribution across the Intel mounting frame for efficient heat transfer, thanks to a uniform CPU contact surface
NATIVE AMD OFFSET MOUNT: Optimized for the multi-die chipset design of Ryzen processors - 5mm offset for optimal CPU hotspot coverage leads to more efficient heat transfer
ACTIVE COOLING OF VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools base zone components such as voltage converters
INTEGRATED WIRING MANAGEMENT: The PWM cables for the radiator fans are integrated into the hose lining, meaning there is only one visible cable connected to the motherboard
LIMITED COMPATIBILITY WITH SOME MOTHERBOARDS: Large heatsinks in the M.2_1 slot may cause compatibility problems. An overview and solution can be found in the technical data, in the manual and on the manufacturer's website. Please use the compatibility check